The phone that could save BlackBerry is remarkably easy to take apart, thanks in part to its easily removed back cover.
But the guys at iFixit are never happy with simply taking the back off a gadget. No, they have to get in there and rip things apart, and the Z10's innards have been splayed across the table of the iFixit compound. The phone that Waterloo built scores an 8 out of 10 on the repairability score, which means it's a snap to fix.
After popping off the back, getting to the motherboard is as simple as removing a few screws -- one of which is hidden behind a tab you must remove with a spudger -- that secure the plastic cover holding it in place. Once that's done, the only things holding the motherboard in place are a few connectors. The most difficult items to rip from the inside of the device are the module headphone jack and camera, mostly because they're held in place with liberal amounts of adhesive.
The phone is powered by a Qualcomm MSM8960 Snapdragon S4 processor and uses the same Qualcomm RTR8600 Multi-band/mode RF transceiver as the iPhone 5 and Samsung Galaxy S III. The display is ultrathin thanks to the digitizer (the element that detects all your swiping and touching) being fused to the glass, which is then fused to the LCD. So if you break the glass, the LCD and digitizer are broken as well.
Check out the whole gory disassembly on iFixit.
