Every Little Bit Helps Dept.: The manufacturer of the heat sinks in Sony's PlayStation 3 said last week that it had completed the development of a cheaper, smaller version of the part.
Furukawa Electric Co. recently exhibited a new heat sink for the PS3 that's 150 grams lighter than the second-generation model and half the weight of the heat sink used in the original PS3s.
The reduction in size and cost comes from Sony's use of lower-heat 65nm Cell processors in newer versions of the PlayStation 3 hardware. Older models, which used 90nm versions of the processor chip, needed larger, more expensive heat sinks to dissipate the heat thrown off by Cell.
While every announcement about cost reductions in a piece of game hardware generally sparks speculation about a price drop or even a hardware refresh, keep in mind that this news by itself is not evidence of any such thing.
3rd-gen Heatsink for PS3 Unveiled [Tech On]
